- rigid PCB (up to 20-layers), flex-rigid PCB (4-layers), flexible PCB (2-layers), Thermal clad
- high-speed design (delay tuning), controlled impedances, microvias, blind/buried vias, ELIC plated half-holes, etc.
- EMI/EMC-optimized layout.
- up to 3500 components on PCB, HDI PCB, up to 2000 pin BGA packages, DDR3/4 memories, PCIe 3.0, HDMI, USB3.0, 10GigEhternet, up to 20A power source layout, and more..
- RF structures – Antenas, filters
- products from industrial, automotive, medical, telecommunication
- communication with PCB suppliers (technical capabilities, stack-up and DFx consultations, etc.)